Shilei Dai
ORCID: 0000-0002-5849-0503Also affiliated with University of Chicago, Education University of Hong Kong, University of Hong Kong
EngineeringMaterials ScienceNeuroscienceComputer Science
Pilot corpus only
This score is computed over theSindex pilot corpus and does not cover the full scientific literature. Scores are relative to papers we have ingested — papers, authors, and institutions outside the pilot are not represented. Methodology.
Top 100%percentile
Indexed papers
0in pilot corpus
Papers
Driven by 2 papers. Top paper: “Achieving tissue-level softness on stretchable electronics through a generalizable soft interlayer design”.
153 citations
Nan Li, Wei Liu, Aleksander Promiński, Seoung‐Hun Kang, Yahao Dai +13 more
N/A
2 citations
Zixuan Zhao, Max Weires, Shiyu Hu, Yang Li, Lingfeng Tang +17 more