Jeong‐Woong Shin

Also affiliated with Samsung (South Korea)

EngineeringMaterials ScienceNeuroscience

Pilot corpus only

This score is computed over theSindex pilot corpus and does not cover the full scientific literature. Scores are relative to papers we have ingested — papers, authors, and institutions outside the pilot are not represented. Methodology.

Top 100%percentile

0Author DataRank

Indexed papers

0in pilot corpus

datarank_citation_only_1hop_v6· scope data_onlyMethodology

Papers

Driven by 1 paper. Top paper: “Materials and Designs for Extremely Efficient Encapsulation of Soft, Biodegradable Electronics”.

Materials and Designs for Extremely Efficient Encapsulation of Soft, Biodegradable Electronics

Advanced Functional Materials(2024)10.1002/adfm.202403427

N/A

0DataRank · unranked

29 citations

Heeseok Kang, Won Bae Han, Ankan Dutta, Jeong‐Woong Shin, Tae‐Min Jang +9 more