🏆 Finalist — NIH Data Sharing Index (“S-Index”) Challenge

Mu Du

Shandong University

ORCID: 0000-0002-9614-5508

Also affiliated with City University of Hong Kong, Shenzhen Research Institute

Materials ScienceEngineeringChemistry

Pilot corpus only

This score is computed over theSindex pilot corpus and does not cover the full scientific literature. Scores are relative to papers we have ingested — papers, authors, and institutions outside the pilot are not represented. Methodology.

Top 100%percentile
0Author DataRank

Indexed papers

1in pilot corpus
datarank_citation_only_1hop_v6· scope data_onlyMethodology
Why this DataRank?

An author's DataRank is the sum of the DataRanks of all 1 indexed paper attributed to them. A prolific author with many moderate-impact papers can outrank one with a single high-impact paper.

Author scores recompute whenever paper DataRanks are refreshed, so this number lags the underlying paper scores by at most one batch run.

Read the full methodology →

Papers

Driven by 1 paper. Top paper: “Numerical study on the effect of thermal pad on enhancing interfacial heat transfer considering thermal contact resistance”.

Numerical study on the effect of thermal pad on enhancing interfacial heat transfer considering thermal contact resistance

Case Studies in Thermal Engineering(2023)10.1016/j.csite.2023.103226
N/A
1.0DataRank · unranked
29 citations

Qing-Feng Tang, Heng Zhang, Jian-Rong Zhang, Mu Du, Wen-Quan Tao +1 more