🏆 Finalist — NIH Data Sharing Index (“S-Index”) Challenge

Hongxu Liu

Shanghai Normal University

ORCID: 0000-0003-0076-1259
Materials ScienceChemistry

Pilot corpus only

This score is computed over theSindex pilot corpus and does not cover the full scientific literature. Scores are relative to papers we have ingested — papers, authors, and institutions outside the pilot are not represented. Methodology.

Top 100%percentile
0Author DataRank

Indexed papers

0in pilot corpus
datarank_citation_only_1hop_v6· scope data_onlyMethodology

Papers

Driven by 5 papers. Top paper: Molecular bases for temperature sensitivity in supramolecular assemblies and their applications as thermoresponsive soft materials.

45 citations

Theeraphop Prachyathipsakul, Thameez M. Koyasseril-Yehiya, Stephanie P. Le, S. Thayumanavan, Hongxu Liu

31 citations

Hung‐Hsun Lu, Yasin Alp, Ruiling Wu, S. Thayumanavan, Hongxu Liu

7 citations

Theeraphop Prachyathipsakul, Jiaming Zhuang, Hongxu Liu, Yanhui Han, Bin Liu +14 more

12 citations

Harnimarta Deol, Ava Raeisbahrami, Hadis Askari, Christopher D. Wight, Vincent M. Lynch +2 more

3 citations

Harnimarta Deol, Eric V. Anslyn, Hongxu Liu