Next Generation of 3D‐Printed Electronics: Electroplating Inside Channels to Embed 3D Copper Features within Polymeric Structures Fabricated Through Material Extrusion is a research paper published in Advanced Materials Technologies (2024). On theSindex it has a DataRank of 0. It has been cited 8 times.
Scored on demand from live citation data
DataRank reads this dataset's downstream impact straight off the citation graph — no black box, no proprietary weighting. How is this computed?
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National Institutes of Health
Grant: U12AB123456
FWCI
0.95
Citation Percentile
0.7%
Citation Trend
Fields of Study
Keywords