A novel mechanical diced trench structure for warpage reduction in wafer level packaging process is a research paper published in Microelectronics Reliability (2015). On theSindex it has a DataRank of 0.345. It has been cited 9 times.
Scored on demand from live citation data
DataRank reads this dataset's downstream impact straight off the citation graph — no black box, no proprietary weighting. How is this computed?
FAIR checklist signals are shown for context only and do not affect DataRank scoring.
We only score data papers we can read in full — never from an abstract alone.
Base Score Contribution
0.345
From this paper's citation signal
Citation Network Contribution
0
Citation network not refreshed for this result
This paper's DataRank is currently driven only by its base citation score. Citation network data was not refreshed for this result.
Learn more about DataRank methodology →National Science and Technology
Grant: 2009ZX02025
National Science and Technology
Grant: 2011ZX02602
Natural Science Foundation of Shanghai
Grant: 13ZR1447300
FWCI
0.66
Citation Percentile
0.7%
Citation Trend
Fields of Study
Keywords