A combined wafer bonding method using spin-coated water glass adhesive layer and spot pressing bonding technique is a research paper published in 2016 13th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) (2016). On theSindex it has a DataRank of 0.
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FWCI
0.00
Citation Percentile
0.3%
Fields of Study
Keywords
Sustainable Development Goals